$1.00
Single Row Horizontal SMT Nano-D / Bi-Lobe® nanos offer an extremely low profile package that is well suited for pick and place mounting methods. They have a very tight pitch of .025″ (.64 mm) centerlines.
| Title | Type | File |
| Nano-D / Bi-Lobe® Single Row Thru-Hole Horizontal (H2) Contact | Download | |
| Nano-D / Bi-Lobe® Single Row Thru-Hole Horizontal (H2) Ordering Guide | Download | |
| Nano-D / Bi-Lobe® Single Row Thru-Hole Horizontal (H2) Hardware & Misc. | Download |
Single Row Horizontal SMT Nano-D / Bi-Lobe® nanos offer an extremely low profile package that is well suited for pick and place mounting methods. They have a very tight pitch of .025″ (.64 mm) centerlines..
| Omnetics Series |
MBPS ,MBSS |
|---|---|
| Rows |
1 Row |
| Termination Type |
H2 – Right Angle Thru-Hole |
| Electrical Mechanical Specifications |
– |
| Temperature |
-55ºC to +125ºC (200 ºC w/HTE) |
| Dielectric Withstand Voltage |
250 VAC RMS Sea Level |
| Contact Resistance |
71 mV Drop @ 1 AMP |
| Current Rating |
1 AMP per contact |
| Durability |
200 Mating cycles min* |
| Insulation Resistance |
5000 megohms min @ 100 VDC |
| Shock |
100 gs with no discontinuties > 10 nanoseconds |
| Vibration |
20 gs with no discontinuties > 10 nanoseconds |
| Thermal Vacuum Outgassing |
1.0% max TML, 0.1% max VCM |
| Mating/Unmating Force |
7 oz. (198 g) max per contact |
| Material Specifications |
– |
| Shell Material and Finish |
Aluminum Shell, Electroless Nickel Plated Aluminum Shell, Black AnodizedAluminum Shell, Cadmium PlatedTitanium Shell, UnplatedStainless Steel Shell, Passivated |
| Insulator |
Liquid Crystal Polymer per MIL-DTL-32139 or PEEK |
| Pin |
Gold Plated BeCu |
| Socket |
Gold Plated Copper Alloy |
| Encapsulant |
Epoxy |
Single Row Horizontal SMT Nano-D / Bi-Lobe® nanos offer an extremely low profile package that is well suited for pick and place mounting methods. They have a very tight pitch of .025″ (.64 mm) centerlines.
| Omnetics Series |
MBPS ,MBSS |
|---|---|
| Rows |
1 Row |
| Termination Type |
H2 – Right Angle Thru-Hole |
| Electrical Mechanical Specifications |
– |
| Temperature |
-55ºC to +125ºC (200 ºC w/HTE) |
| Dielectric Withstand Voltage |
250 VAC RMS Sea Level |
| Contact Resistance |
71 mV Drop @ 1 AMP |
| Current Rating |
1 AMP per contact |
| Durability |
200 Mating cycles min* |
| Insulation Resistance |
5000 megohms min @ 100 VDC |
| Shock |
100 gs with no discontinuties > 10 nanoseconds |
| Vibration |
20 gs with no discontinuties > 10 nanoseconds |
| Thermal Vacuum Outgassing |
1.0% max TML, 0.1% max VCM |
| Mating/Unmating Force |
7 oz. (198 g) max per contact |
| Material Specifications |
– |
| Shell Material and Finish |
Aluminum Shell, Electroless Nickel Plated Aluminum Shell, Black AnodizedAluminum Shell, Cadmium PlatedTitanium Shell, UnplatedStainless Steel Shell, Passivated |
| Insulator |
Liquid Crystal Polymer per MIL-DTL-32139 or PEEK |
| Pin |
Gold Plated BeCu |
| Socket |
Gold Plated Copper Alloy |
| Encapsulant |
Epoxy |
